By James J. Licari,Dale W. Swanson

This booklet is exclusive in its complete insurance of all elements of adhesive expertise for microelectronic units and packaging, from thought to bonding to check techniques. as well as normal functions, corresponding to dies, substrate, and lid and chip stack attachments, the ebook comprises new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing equipment corresponding to UV, microwave, and moisture (which conform to present environmental and effort requisites) are lined. Over eighty tables and a hundred and twenty figures offer a wealth of information on houses, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and gear. every one bankruptcy offers complete references.

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