By Rao Tummala


Written by way of Rao Tummala, the field’s best writer, basics of Microsystems Packaging is the single e-book to hide the sphere from wafer to platforms, together with each significant contributing know-how. This rigorous and thorough advent to digital packaging applied sciences can provide a superior grounding in microelectronics, photonics, RF, packaging layout, meeting, reliability, checking out, and production and its relevance to either semiconductors and platforms. You’ll find:

*Full assurance of electric, mechanical, chemical, and fabrics facets of every technology

*Easy-to-read schematics and block diagrams

*Fundamental methods to all procedure issues

*Examples of all universal configurations and technologies—wafer point packaging, unmarried chip, multichip, RF, opto-electronic, microvia forums, thermal and others

*Details on chip-to-board connections, sealing and encapsulation, and production processes

*Basics of electric and reliability testing

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