By Rao Tummala
LEARN approximately MICROSYSTEMS PACKAGING FROM the floor UP
Written by way of Rao Tummala, the field’s best writer, basics of Microsystems Packaging is the single e-book to hide the sphere from wafer to platforms, together with each significant contributing know-how. This rigorous and thorough advent to digital packaging applied sciences can provide a superior grounding in microelectronics, photonics, RF, packaging layout, meeting, reliability, checking out, and production and its relevance to either semiconductors and platforms. You’ll find:
*Full assurance of electric, mechanical, chemical, and fabrics facets of every technology
*Easy-to-read schematics and block diagrams
*Fundamental methods to all procedure issues
*Examples of all universal configurations and technologies—wafer point packaging, unmarried chip, multichip, RF, opto-electronic, microvia forums, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and production processes
*Basics of electric and reliability testing
Read Online or Download Fundamentals of Microsystems Packaging (EPI) PDF
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