By John H. Lau,Ricky S.W. Lee

the 1st complete, in-depth advisor to chip scale packaging, this reference grants state-of-the-art info at the most crucial new improvement in digital packaging considering the fact that floor mount know-how (SMT). that includes the newest layout thoughts, plus information on greater than forty varieties of CSP, Chip Scale package deal fingers engineers and architects the entire, expert set of operating instruments that they should clear up technical and layout concerns; locate the most productive, low-priced CSP suggestions for his or her deployments; solution questions about interfacing, pace, robustness, and extra; examine houses of wirebonds, turn chips, inflexible and flex substrates, wafer-level redistribution, and different CSP items; get the newest info on new choices from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, nationwide Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and different significant businesses; and know about CSP items below improvement. A revolution in electronics, CSP is taking the electronics by means of hurricane. web page after web page, this standard-setting advisor supplies either crucial technical information and an eye-opening evaluation of this fast-developing box. regardless of the way you use Chip Scale package deal, youÕll see why itÕs the source of selection if you are looking to be on the best of the game.

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